Applications are invited for the Taiwan International Graduate Internship Program 2020 (Fully Funded) Online Applications for 2020 TIGP International Internship Program (TIGP-IIP) will be open from January 1st to February 29th, 2020. The Taiwan International Graduate Program (http://tigp.sinica.edu.tw/) is pleased to announce that we start to accept applications to our 2020 International Internship Program (TIGP-IIP) in January 2020.
The TIGP is a unique all-English Ph.D. program supported by Academia Sinica (www.sinica.edu.tw), the most prestigious research institution in Taiwan. In collaboration with top-ranking local research universities, the TIGP would like to invite outstanding young scholars from around the globe to experience Taiwan’s top-notch scientific research facilities and to participate in build an intellectual network of people from different ethnic and cultural backgrounds.
This program typically takes place during July and August. However, the dates can be changed by the host PI upon request. Ideally, the qualified intern will be hosted by the PI of his or her choice. At the end of the internship, interns are required to submit a report and/or give a presentation about their research projects. Upon completion of each intern’s project, an evaluation report will be filed by the host scientist, which may later serve as a supportive document towards application for admission to TIGP.
Taiwan Internship Program Highlights:
- Orientation—Introduction to Academia Sinica and Taiwan International Graduate Program
- Visits to TIGP partner institutions and sightseeing/field trips
- Basic or fundamental Chinese language classes: free, classes can be waived if the intern has a basic knowledge of Mandarin/Chinese or upon request by the mentor.
- Internship Report/Poster Presentation
- Certificate awarding ceremony
Taiwan Internship Program Detail:
- Country:Â Taiwan
- Location:Â Academia Sinica, Taipei, Taiwan or Partner University
- Duration:Â 2 Months (May and August)
- Financial Coverage:Â Fully Funded
- Application opens: 1st January 2020
- The deadline to submit applications: February 29th, 2020
- Announcement of Results: Last week of March or first week of April 2020Â
Benefits:
The Taiwan Summer Internship is a Fully Funded International Internship Program. All Expenses Covered Free Internships abroad.
- On-Campus Off-Campus Accommodation.
- NTD 30,000/Month-tax free (~USD 1000) for Two Months.
- TIGP will Provide a Monthly Stipend of NTD 20,000/Months and the Sponsoring faculty will provide Additional Monthly Stipend of NTD 10,000/Month.
- In addition, half of the Cheapest Round-Way Airfare at Economy Class. (Only the Cheapest Routes will be Reimbursed)
Available Area of Fields:
- Chemical Biology and Molecular Biophysics
- Molecular Science and Technology
- Molecular and Biological Agricultural Sciences
- Bioinformatics
- Molecular and Cell Biology
- Nano Science and Technology
- Molecular Medicine
- Earth System Science
- Biodiversity
- Interdisciplinary Neuroscience
- Sustainable Chemical Science and Technology
- Social Networks and Human-Centered Computing
Eligibility Criteria:
The TIGP-IIP welcomes applications from overseas candidates of the following status:
- Undergraduate students who will have been conferred a B.S. degree by August 2021.
(Or students who will have been conferred a B.S.+M.S. dual degree by August 2021.) - Students pursuing a Master’s degree and holding a B.S. degree.
- Individuals holding a B.S. or Master’s degree (student’s pursuing a Ph.D. degree are not eligible for this category)
- Students/ Individuals who have attended TIGP-IIP program before are not eligible to apply again.
Deadline:
The last date to apply for the Taiwan International Graduate Internship Program 2020 (Fully Funded) is 29 February 2020.
How to Apply:
Please visit the official link to apply for the Taiwan International Graduate Internship Program 2020 (Fully Funded). It is in the interest of the applicants to study in detail and thoroughly observe the guidelines given on the official website before and while applying.